Waste FR-4 printed circuit board recycling technology based on supercritical fluid carbon dioxide

Zhi Feng Liu; Bao Zhen Zhang; Hong Chao Zhang

Waste FR-4 printed circuit board recycling technology based on supercritical fluid carbon dioxide

Zhi Feng Liu, Bao Zhen Zhang, Hong Chao Zhang

Industrial Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

To create a model for recycling technology, a waste FR-4 printed circuit board (PCB) recycling process employing supercritical fluid CO₂ (SCF-CO₂) is studied using central composite design. The influence of temperature and treatment time on the PCB delamination ratio, latitudinal tensile strength of glass fiber sheets, and their synthesized effect are analyzed. The optimal temperature and treatment time for FR-4 PCB recycling with SCF-CO₂ are found by building a quadratic polynomial equation model of output parameters in recycling technology. The accuracy of the derived optimal temperature and treatment time is validated by a series of experiments.

Original language	English
Pages (from-to)	202-206
Number of pages	5
Journal	Chongqing Daxue Xuebao/Journal of Chongqing University
Volume	32
Issue number	2
State	Published - Feb 2009

Keywords

Central composite design
FR-4 printed circuit board
Recycling technology
Supercritical fluid CO

Cite this

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title = "Waste FR-4 printed circuit board recycling technology based on supercritical fluid carbon dioxide",

abstract = "To create a model for recycling technology, a waste FR-4 printed circuit board (PCB) recycling process employing supercritical fluid CO2 (SCF-CO2) is studied using central composite design. The influence of temperature and treatment time on the PCB delamination ratio, latitudinal tensile strength of glass fiber sheets, and their synthesized effect are analyzed. The optimal temperature and treatment time for FR-4 PCB recycling with SCF-CO2 are found by building a quadratic polynomial equation model of output parameters in recycling technology. The accuracy of the derived optimal temperature and treatment time is validated by a series of experiments.",

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N2 - To create a model for recycling technology, a waste FR-4 printed circuit board (PCB) recycling process employing supercritical fluid CO2 (SCF-CO2) is studied using central composite design. The influence of temperature and treatment time on the PCB delamination ratio, latitudinal tensile strength of glass fiber sheets, and their synthesized effect are analyzed. The optimal temperature and treatment time for FR-4 PCB recycling with SCF-CO2 are found by building a quadratic polynomial equation model of output parameters in recycling technology. The accuracy of the derived optimal temperature and treatment time is validated by a series of experiments.

AB - To create a model for recycling technology, a waste FR-4 printed circuit board (PCB) recycling process employing supercritical fluid CO2 (SCF-CO2) is studied using central composite design. The influence of temperature and treatment time on the PCB delamination ratio, latitudinal tensile strength of glass fiber sheets, and their synthesized effect are analyzed. The optimal temperature and treatment time for FR-4 PCB recycling with SCF-CO2 are found by building a quadratic polynomial equation model of output parameters in recycling technology. The accuracy of the derived optimal temperature and treatment time is validated by a series of experiments.

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KW - FR-4 printed circuit board

KW - Recycling technology

KW - Supercritical fluid CO

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Waste FR-4 printed circuit board recycling technology based on supercritical fluid carbon dioxide

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Keywords

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