Waste FR-4 printed circuit board recycling technology based on supercritical fluid carbon dioxide

Zhi Feng Liu, Bao Zhen Zhang, Hong Chao Zhang

Research output: Contribution to journalArticle

Abstract

To create a model for recycling technology, a waste FR-4 printed circuit board (PCB) recycling process employing supercritical fluid CO2 (SCF-CO2) is studied using central composite design. The influence of temperature and treatment time on the PCB delamination ratio, latitudinal tensile strength of glass fiber sheets, and their synthesized effect are analyzed. The optimal temperature and treatment time for FR-4 PCB recycling with SCF-CO2 are found by building a quadratic polynomial equation model of output parameters in recycling technology. The accuracy of the derived optimal temperature and treatment time is validated by a series of experiments.

Original languageEnglish
Pages (from-to)202-206
Number of pages5
JournalChongqing Daxue Xuebao/Journal of Chongqing University
Volume32
Issue number2
StatePublished - Feb 1 2009

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Keywords

  • Central composite design
  • FR-4 printed circuit board
  • Recycling technology
  • Supercritical fluid CO

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