Viscoelastic properties and residual stresses in polyhedral oligomeric silsequioxane (POSS)-reinforced epoxy

Qingxiu Li, Stephen A. Hutcheson, Gregory B. McKenna, Sindee L. Simon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports the viscoelastic properties and residual stresses of fully cured epoxy/polyhedral oligomeric silsequioxane (POSS) nanocomposites to be used in fiber-reinforced composites having mitigated residual stress. The epoxy-functionalized POSS molecule is used in the composite systems providing an interlayer with tailored characteristics. The effect of POSS loading on the viscoelastic properties of the epoxy/POSS composites is investigated upon shear stress relaxation and dynamic measurements. The glass transition temperature, glassy coefficient of thermal expansion (CTE) of epoxy/POSS nanocomposites, and the β-relaxation of epoxy matrix as a function of POSS content are also examined.

Original languageEnglish
Title of host publicationSociety of Plastics Engineers - 66th Annual Technical Conference of the Society of Plastics Engineers, Plastics Encounter at ANTEC 2008
Pages1923-1929
Number of pages7
StatePublished - 2008
Event66th Annual Technical Conference of the Society of Plastics Engineers, Plastics Encounter at ANTEC 2008 - Milwaukee, WI, United States
Duration: May 4 2008May 8 2008

Publication series

NameTechnical Papers, Regional Technical Conference - Society of Plastics Engineers
Volume3

Conference

Conference66th Annual Technical Conference of the Society of Plastics Engineers, Plastics Encounter at ANTEC 2008
CountryUnited States
CityMilwaukee, WI
Period05/4/0805/8/08

Keywords

  • Epoxy
  • Nanocomposites
  • Polyhedral oligomeric silsequioxane (POSS)
  • Residual stress
  • Viscoelastic properties

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