UVAG of brittle materials: DoE with a cutting force model

Na Qin, Z. J. Pei, W. L. Cong, D. M. Guo

Research output: Contribution to conferencePaper

1 Scopus citations

Abstract

Ultrasonic-vibration-Assisted grinding (UVAG) combines the material removal mechanisms of diamond grinding and ultrasonic machining. Models have been presented to predict material removal rate and edge chipping and many experiments have also been conducted. However, there were no models on cutting force in UVAG of brittle materials until the authors developed one. Based on this developed model, this paper reports a systematic study on cutting force in UVAG of brittle materials using a 26 factorial design. The main effects, two-factor and three-factor interaction effects on cutting force are revealed and compared with those obtained experimentally.

Original languageEnglish
StatePublished - 2010
EventIIE Annual Conference and Expo 2010 - Cancun, Mexico
Duration: Jun 5 2010Jun 9 2010

Conference

ConferenceIIE Annual Conference and Expo 2010
CountryMexico
CityCancun
Period06/5/1006/9/10

Keywords

  • Brittle material
  • Cutting force
  • Design of experiment
  • Ultrasonic-vibration- Assisted grinding

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    Qin, N., Pei, Z. J., Cong, W. L., & Guo, D. M. (2010). UVAG of brittle materials: DoE with a cutting force model. Paper presented at IIE Annual Conference and Expo 2010, Cancun, Mexico.