We describe a long-standing and successful university-industry partnership in semiconductor device engineering with a primary focus on product and test engineering. The partnership, now (2013) in its 15th year, relies on a symbiotic relationship that has evolved over the years to reflect semiconductor industry trends and advancing university capabilities. The success of the partnership is due to a multifaceted approach with an emphasis on frequent interactions between company personnel and university faculty and students. These interactions feed the core component of the program, student internships. These internships, for which students can obtain course credit, are done at both the undergraduate and graduate level and provide a nearly seamless pathway from school to full- Time employment.
|State||Published - 2014|
|Event||121st ASEE Annual Conference and Exposition: 360 Degrees of Engineering Education - Indianapolis, IN, United States|
Duration: Jun 15 2014 → Jun 18 2014
|Conference||121st ASEE Annual Conference and Exposition: 360 Degrees of Engineering Education|
|Period||06/15/14 → 06/18/14|