Ultrasonic-vibration-assisted grinding of brittle materials: A mechanistic model for cutting force

Na Qin, Z. J. Pei, W. L. Cong, C. Treadwell, D. M. Guo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

10 Scopus citations

Abstract

A mechanistic model for cutting force in ultrasonic-vibration-assisted grinding (UVAG) (also called rotary ultrasonic machining) of brittle materials is proposed for the first time. Fundamental assumptions include: (1) brittle fracture is the dominant mechanism of material removal, and (2) the removed volume by each diamond grain in one vibration cycle can be related to its indentation volume in the workpiece through a mechanistic parameter. Experiments with UVAG of silicon are conducted to determine the mechanistic parameter for silicon. With the developed model, influences of six input variables on cutting force are predicted. These predicted influences trends are also compared with those determined experimentally for several brittle materials.

Original languageEnglish
Title of host publicationASME 2011 International Manufacturing Science and Engineering Conference, MSEC 2011
Pages127-136
Number of pages10
DOIs
StatePublished - 2011
EventASME 2011 International Manufacturing Science and Engineering Conference, MSEC 2011 - Corvallis, OR, United States
Duration: Jun 13 2011Jun 17 2011

Publication series

NameASME 2011 International Manufacturing Science and Engineering Conference, MSEC 2011
Volume1

Conference

ConferenceASME 2011 International Manufacturing Science and Engineering Conference, MSEC 2011
CountryUnited States
CityCorvallis, OR
Period06/13/1106/17/11

Keywords

  • Brittle material
  • Cutting force
  • Grinding
  • Machining
  • Silicon
  • Ultrasonic vibration

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