Trident Shape SOI Metamaterial Fiber-to-Chip Edge Coupler

Min Teng, Ben Niu, Kyunghun Han, Sangsik Kim, Yi Xuan, Yun Jo Lee, Minghao Qi

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

We propose a fiber-to-chip edge coupler based on trident-shaped dielectric metamaterial. Experiment shows < 2 dB/facet coupling loss with high NA fiber and near 0.5 dB/facet coupling loss using lensed fiber at the best polarization.

Original languageEnglish
Title of host publication2019 Optical Fiber Communications Conference and Exhibition, OFC 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781943580538
DOIs
StatePublished - Apr 22 2019
Event2019 Optical Fiber Communications Conference and Exhibition, OFC 2019 - San Diego, United States
Duration: Mar 3 2019Mar 7 2019

Publication series

Name2019 Optical Fiber Communications Conference and Exhibition, OFC 2019 - Proceedings

Conference

Conference2019 Optical Fiber Communications Conference and Exhibition, OFC 2019
Country/TerritoryUnited States
CitySan Diego
Period03/3/1903/7/19

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