Fingerprint Dive into the research topics of 'Thermal Pressure Coefficient of a Polyhedral Oligomeric Silsesquioxane (POSS)-Reinforced Epoxy Resin'. Together they form a unique fingerprint.
- Sort by
- Weight
- Alphabetically
Thermal Pressure Coefficient of a Polyhedral Oligomeric Silsesquioxane (POSS)-Reinforced Epoxy Resin
Kyaw Z. Win, Taskin Karim, Qingxiu Li, Sindee L. Simon, Gregory McKenna
Research output: Contribution to journal › Article › peer-review