Thermal Pressure Coefficient of a Polyhedral Oligomeric Silsesquioxane (POSS)-Reinforced Epoxy Resin

Kyaw Z. Win, Taskin Karim, Qingxiu Li, Sindee L. Simon, Gregory McKenna

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)142-146
JournalJournal of Applied Polymer Science
StatePublished - 2010

Fingerprint Dive into the research topics of 'Thermal Pressure Coefficient of a Polyhedral Oligomeric Silsesquioxane (POSS)-Reinforced Epoxy Resin'. Together they form a unique fingerprint.

Cite this