Thermal pressure coefficient of a polyhedral oligomeric silsesquioxane (POSS)-reinforced epoxy resin

K. Z. Win, Taskin Karim, Qingxiu Li, Sindee L. Simon, Gregory B. McKenna

Research output: Contribution to journalArticle

7 Scopus citations

Abstract

The thermal pressure coefficients of a neat, unfilled, epoxy resin and a 10 wt % POSS (polyhedral oligomeric silsesquioxane)-filled epoxy nanocomposite have been measured using a thick-walled tube method. It is found that just below the glass transition temperature the thermal pressure coefficient is ∼ 20% smaller for the polymer composite containing 10% POSS than for the neat, unfilled resin. The thermal expansion coefficient and thermal pressure coefficient of the uncured POSS itself are also reported.

Original languageEnglish
Pages (from-to)142-146
Number of pages5
JournalJournal of Applied Polymer Science
Volume116
Issue number1
DOIs
StatePublished - Apr 5 2010

Keywords

  • Epoxy
  • High-pressure vessel
  • Nanocomposites
  • Polymer
  • Poss
  • Residual stress
  • Thermal pressure coefficient
  • Thermoset

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