Thermal performance of water-cooled heat sinks: A comparison of two different designs

T. E. Salem; D. Porschet; S. B. Bayne

doi:10.1109/STHERM.2005.1412190

Thermal performance of water-cooled heat sinks: A comparison of two different designs

T. E. Salem, D. Porschet, S. B. Bayne

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

6 Scopus citations

Abstract

As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled polearrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.

Original language	English
Title of host publication	21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Pages	264-269
Number of pages	6
DOIs	https://doi.org/10.1109/STHERM.2005.1412190
State	Published - 2005
Event	21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, United States Duration: Mar 15 2005 → Mar 17 2005

Publication series

Name	Annual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN (Print)	1065-2221

Conference

Conference	21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Country/Territory	United States
City	San Jose, CA
Period	03/15/05 → 03/17/05

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10.1109/STHERM.2005.1412190

Cite this

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title = "Thermal performance of water-cooled heat sinks: A comparison of two different designs",

abstract = "As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled polearrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.",

author = "Salem, {T. E.} and D. Porschet and Bayne, {S. B.}",

year = "2005",

doi = "10.1109/STHERM.2005.1412190",

language = "English",

isbn = "0780389859",

series = "Annual IEEE Semiconductor Thermal Measurement and Management Symposium",

pages = "264--269",

booktitle = "21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium",

note = "null ; Conference date: 15-03-2005 Through 17-03-2005",

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Salem, TE, Porschet, D & Bayne, SB 2005, Thermal performance of water-cooled heat sinks: A comparison of two different designs. in 21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 264-269, 21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, CA, United States, 03/15/05. https://doi.org/10.1109/STHERM.2005.1412190

Thermal performance of water-cooled heat sinks : A comparison of two different designs. / Salem, T. E.; Porschet, D.; Bayne, S. B.

21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium. 2005. p. 264-269 (Annual IEEE Semiconductor Thermal Measurement and Management Symposium).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Porschet, D.

AU - Bayne, S. B.

PY - 2005

Y1 - 2005

N2 - As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled polearrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.

AB - As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled polearrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.

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M3 - Conference contribution

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SN - 0780389859

T3 - Annual IEEE Semiconductor Thermal Measurement and Management Symposium

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BT - 21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium

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ER -

Thermal performance of water-cooled heat sinks: A comparison of two different designs

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