Thermal performance of water-cooled heat sinks: A comparison of two different designs

T. E. Salem, D. Porschet, S. B. Bayne

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled polearrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.

Original languageEnglish
Title of host publication21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Pages264-269
Number of pages6
DOIs
StatePublished - 2005
Event21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, United States
Duration: Mar 15 2005Mar 17 2005

Publication series

NameAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN (Print)1065-2221

Conference

Conference21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium
CountryUnited States
CitySan Jose, CA
Period03/15/0503/17/05

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  • Cite this

    Salem, T. E., Porschet, D., & Bayne, S. B. (2005). Thermal performance of water-cooled heat sinks: A comparison of two different designs. In 21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium (pp. 264-269). (Annual IEEE Semiconductor Thermal Measurement and Management Symposium). https://doi.org/10.1109/STHERM.2005.1412190