@inproceedings{eb2c58a0757740e4b16b2441e173ae4b,
title = "Thermal performance of water-cooled heat sinks: A comparison of two different designs",
abstract = "As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled polearrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.",
author = "Salem, {T. E.} and D. Porschet and Bayne, {S. B.}",
year = "2005",
doi = "10.1109/STHERM.2005.1412190",
language = "English",
isbn = "0780389859",
series = "Annual IEEE Semiconductor Thermal Measurement and Management Symposium",
pages = "264--269",
booktitle = "21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium",
note = "null ; Conference date: 15-03-2005 Through 17-03-2005",
}