@inproceedings{672586a799bd41b882d9f0c84242ca6e,
title = "Thermal performance of water-cooled heat sinks",
abstract = "As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled pole-arrayed heat sink versus a novel water-cooled mlcrochannel heat sink.",
author = "Salem, {T. E.} and Bayne, {S. B.} and D. Porschet and Y. Chen",
year = "2005",
doi = "10.1109/APEC.2005.1452902",
language = "English",
isbn = "0780389751",
series = "Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC",
pages = "129--133",
booktitle = "Twentieth Annual IEEEApplied Power ElectronicsConference and Exposition, APEC 2005",
note = "null ; Conference date: 06-03-2005 Through 10-03-2005",
}