Thermal performance of water-cooled heat sinks

T. E. Salem, S. B. Bayne, D. Porschet, Y. Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled pole-arrayed heat sink versus a novel water-cooled mlcrochannel heat sink.

Original languageEnglish
Title of host publicationTwentieth Annual IEEEApplied Power ElectronicsConference and Exposition, APEC 2005
Pages129-133
Number of pages5
DOIs
StatePublished - 2005
Event20th Annual IEEEApplied Power ElectronicsConference and Exposition, APEC 2005 - Austin, TX, United States
Duration: Mar 6 2005Mar 10 2005

Publication series

NameConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
Volume1

Conference

Conference20th Annual IEEEApplied Power ElectronicsConference and Exposition, APEC 2005
CountryUnited States
CityAustin, TX
Period03/6/0503/10/05

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