Thermal analysis of printed circuit board degradation in a supercritical CO2 environment

Zhifeng Liu, Wangsheng Zhang, Hongchao Zhang

Research output: Contribution to journalArticle

Abstract

The bonding material used in printed circuit boards (PCBs), a brominated epoxy resin, should degrade in an oxygen-free environment when the temperature is 300 °C or above, and this is the theoretical basis for recycling PCBs via thermal decomposition. But in the supercritical CO2 fluid environment, the epoxy resin should be incompletely pyrogenated at 260 °C. In this paper, a thermal analysis model of PCBs under high temperature and pressure is established, so the thermal stress that exists inside PCBs is described, and the results indicate that the thermal stress can promote the delamination and decomposition of PCBs in supercritical CO2 environments.

Original languageEnglish
Pages (from-to)2229-2235
Number of pages7
JournalHuanjing Kexue Xuebao/Acta Scientiae Circumstantiae
Volume30
Issue number11
StatePublished - Nov 2010

Keywords

  • Epoxy resin
  • Printed circuit board (PCB)
  • Pyrogenation
  • Supercritical CO fluid
  • Thermal analysis

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