Study of material removal mechanisms in grinding of C/SiC composites via single-abrasive scratch tests

Y.C. Li, X. Ge, Hui Wang, Y.B. Hu, F.D. Ning, Weilong Cong, C.Z. Ren

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)4729-4738
JournalCeramics International
DOIs
StatePublished - Nov 22 2018

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