SiGe class-E power amplifier with envelope tracking for mobile WiMAX/Wibro applications

Yan Li, Jerry Lopez, Donald Y.C. Lie, Kevin Chen, Stanley Wu, Tzu Yi Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

In this paper, we report both circuits design and system simulations using highly-efficient monolithic SiGe class-E power amplifier (PA) with an open-loop envelope tracking (ET) technique for mobile WiMAX/Wibro applications. The 1-stage and 2-stage class-E PAs were designed and fabricated in a 0.18μm BiCMOS SiGe technology. The 1-stage class-E PA achieved peak power added efficiency (PAE) of 62% at output power of 21dBm in single-tone measurement. The design of linear-assisted switching envelope amplifier is also discussed, which involves balancing the tradeoff between efficiency and signal fidelity. Detailed co-design system simulations including RF circuits and digital DSP blocks show that our class-E PA can be linearized by the open-loop ET technique, and the entire ET-based transmit (TX) system meets the stringent 802.16e TX mask with ∼33% overall average efficiency at output power of 18.5dBm.

Original languageEnglish
Title of host publication2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009
Pages2017-2020
Number of pages4
DOIs
StatePublished - 2009
Event2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009 - Taipei, Taiwan, Province of China
Duration: May 24 2009May 27 2009

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
ISSN (Print)0271-4310

Conference

Conference2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009
CountryTaiwan, Province of China
CityTaipei
Period05/24/0905/27/09

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  • Cite this

    Li, Y., Lopez, J., Lie, D. Y. C., Chen, K., Wu, S., & Yang, T. Y. (2009). SiGe class-E power amplifier with envelope tracking for mobile WiMAX/Wibro applications. In 2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009 (pp. 2017-2020). [5118188] (Proceedings - IEEE International Symposium on Circuits and Systems). https://doi.org/10.1109/ISCAS.2009.5118188