Semiconductor Process Variation Analysis using Implicit Differentiation Chain Rule

Tongdan Jin, Qiyu Huang, Xiulan Cheng, Yisha Xiang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

—Modeling and propagating the variance of performance measures becomes a formidable task as today’s integrated circuits consist of multiple layers with dozens of process variables. We propose a top-down variance decomposition method to estimate the variation of system performance considering the correlation of dependent variables across different layers. Using implicit differentiation chain rule, the idea is to sequentially decompose the variance of system performance down to the process level without explicitly computing the covariance of dependent variables at the intermediate levels. Compared with simulations and other analytical methods, the new method reduces the computational time while keeping good estimation accuracy.

Original languageEnglish
Title of host publicationProceedings - 25th ISSAT International Conference on Reliability and Quality in Design
EditorsHoang Pham
PublisherInternational Society of Science and Applied Technologies
Pages233-238
Number of pages6
ISBN (Electronic)9780991057672
StatePublished - Jan 1 2019
Event25th ISSAT International Conference on Reliability and Quality in Design, RQD 2019 - Las Vegas, United States
Duration: Aug 1 2019Aug 3 2019

Publication series

NameProceedings - 25th ISSAT International Conference on Reliability and Quality in Design

Conference

Conference25th ISSAT International Conference on Reliability and Quality in Design, RQD 2019
CountryUnited States
CityLas Vegas
Period08/1/1908/3/19

Keywords

  • Chain rule
  • Process variation
  • Statistical static timing analysis
  • Variance propagation

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  • Cite this

    Jin, T., Huang, Q., Cheng, X., & Xiang, Y. (2019). Semiconductor Process Variation Analysis using Implicit Differentiation Chain Rule. In H. Pham (Ed.), Proceedings - 25th ISSAT International Conference on Reliability and Quality in Design (pp. 233-238). (Proceedings - 25th ISSAT International Conference on Reliability and Quality in Design). International Society of Science and Applied Technologies.