Modern power electronics systems try to maximize power density and efficiency. As such, the active switch is required to safely handle very stressful transient conditions. A 56 mm2, 180 A, SiC DMOSFET manufactured by Cree Inc. is evaluated by electrically stressing the device in a RLC ring-down test system capable of producing peak current in excess of 600 A (>3X rated current) and di/dt's as high as 860 A/μs. The device was hard-switched 5,000 times at repetition rates of 1, 2, 5, and 10 Hz for a total of 20,000 switching events. The device characteristics were monitored every 1,000 shots on a high power curve tracer to determine device degradation. The devices showed no changes in blocking characteristics and minimal changes in on-state characteristics due to shifts in the threshold voltage after 20,000 hard switching events. The threshold voltage shifts over the test period are minimal with a +/- 93 mV deviation from the average of 4.39 V. With the stability of the threshold voltage, on-state characteristics, and blocking characteristics; this shows that this device would perform reliably within commercial applications that include stressful switching conditions.