Rotary ultrasonic machining of sapphire: Feasibility study and designed experiments

Chenglong Zhang, Pingfa Feng, Zhijian Pei, Weilong Cong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

23 Scopus citations

Abstract

Sapphire, widely used in high-speed integrated-circuit chips, thin-film substrates, and various electronic components, is regarded as one of the most difficult to cut materials owing to its great hardness and low fracture toughness. Rotary ultrasonic machining (RUM) has been regarded as an effective processing method for hard and brittle materials. In this paper, RUM process is introduced into the drilling of sapphire for the first time. The feasibility to machine sapphire using RUM is studied. Moreover, results of a designed experimental study into RUM of sapphire are presented to discuss the main effects as well as interaction effects of process parameters (ultrasonic power, spindle speed, and feedrate) on outputs. The process outputs investigated include cutting force and edge chipping size.

Original languageEnglish
Title of host publicationAdvances in Machining and Manufacturing Technology XII
PublisherTrans Tech Publications Ltd
Pages523-528
Number of pages6
ISBN (Print)9783037858929
DOIs
StatePublished - 2014
Event12th Conference on Machining and Advanced Manufacturing Technology, CMAMT 2013 - Xiamen, China
Duration: Jul 24 2013Jul 27 2013

Publication series

NameKey Engineering Materials
Volume589-590
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795

Conference

Conference12th Conference on Machining and Advanced Manufacturing Technology, CMAMT 2013
CountryChina
CityXiamen
Period07/24/1307/27/13

Keywords

  • Cutting force
  • Drilling
  • Edge chipping size
  • Rotary ultrasonic machining
  • Sapphire

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  • Cite this

    Zhang, C., Feng, P., Pei, Z., & Cong, W. (2014). Rotary ultrasonic machining of sapphire: Feasibility study and designed experiments. In Advances in Machining and Manufacturing Technology XII (pp. 523-528). (Key Engineering Materials; Vol. 589-590). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.589-590.523