TY - GEN
T1 - "RF-SoC"
AU - Lie, D. Y.C.
AU - Yuan, Xiaojuen
AU - Larson, L. E.
AU - Wang, Y. H.
AU - Senior, A.
AU - Mecke, J.
N1 - Publisher Copyright:
© 2002 IEEE.
PY - 2002
Y1 - 2002
N2 - The integration level of RFICs has exhibited considerable progress during the last decade. Si-based single-chip GSM, Bluetooth and DECT transceivers have been reported, while the most exciting milestone for integration will be the RF-system-on-a-chip (i.e., "RF-SoC") product for single-chip multiband multi-standard cellular ICs that support broadband communication. To achieve this highest level of RFIC integration, one has to choose a radio system architecture that requires a minimal number of external components, together with a judicious selection of the IC technology for implementation. For example, we anticipate the direct-conversion or a robust low-IF receiver architecture to become the dominant choice for 3G handset applications. We also expect the Si/SiGe BiCMOS technology to be the optimal device technology for implementing low-power cellular RF-SoC products, while RF-CMOS technology will probably be most successful for the low-cost, less performance sensitive Bluetooth and/or wireless LAN applications.
AB - The integration level of RFICs has exhibited considerable progress during the last decade. Si-based single-chip GSM, Bluetooth and DECT transceivers have been reported, while the most exciting milestone for integration will be the RF-system-on-a-chip (i.e., "RF-SoC") product for single-chip multiband multi-standard cellular ICs that support broadband communication. To achieve this highest level of RFIC integration, one has to choose a radio system architecture that requires a minimal number of external components, together with a judicious selection of the IC technology for implementation. For example, we anticipate the direct-conversion or a robust low-IF receiver architecture to become the dominant choice for 3G handset applications. We also expect the Si/SiGe BiCMOS technology to be the optimal device technology for implementing low-power cellular RF-SoC products, while RF-CMOS technology will probably be most successful for the low-cost, less performance sensitive Bluetooth and/or wireless LAN applications.
UR - http://www.scopus.com/inward/record.url?scp=84966472262&partnerID=8YFLogxK
U2 - 10.1109/ICMMT.2002.1187629
DO - 10.1109/ICMMT.2002.1187629
M3 - Conference contribution
AN - SCOPUS:84966472262
T3 - ICMMT 2002 - 2002 3rd International Conference on Microwave and Millimeter Wave Technology
SP - 30
EP - 37
BT - ICMMT 2002 - 2002 3rd International Conference on Microwave and Millimeter Wave Technology
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 17 August 2002 through 19 August 2002
ER -