Abstract
The factors of dismantling force for surface mount devices(SMD) and through hole devices(THD) were analyzed, and the dismantling force model for SMD and THD was established by viscous fluid mechanics principle and material mechanics theory. The minimal dismantling forces of the above mentioned two kinds of components were also calculated, and the results of dismantling experiments show that this model is reasonable. The experiments indicate that horizontal dismantling force of SMD is more greater than vertical dismantling force, and the bend level and quantities of leg wire are the key factors of THD's dismantling force, meanwhile the two kinds of components should be treated separately during the dismantling process.
| Original language | English |
|---|---|
| Pages (from-to) | 1394-1398 |
| Number of pages | 5 |
| Journal | Zhongguo Jixie Gongcheng/China Mechanical Engineering |
| Volume | 20 |
| Issue number | 12 |
| State | Published - Jun 25 2009 |
Keywords
- Dismantling force
- Electronic component
- Experiment
- Model
- Printed circuit board