Reliability study of a MEMS array under varying temperature and humidity conditions

Ganapathy Sivakumar, Ranjith Ranganathan, Richard Gale, Tim Dallas

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work, we quantify and analyze the rate of accrual of stiction and mechanical fatigue in a MEMS micro-mirror device to understand its reliability under a set of controlled temperature and humidity splits. An accelerated aging system was employed by using a non-standard actuation procedure to more rapidly induce failure of the micro-mirrors. The array is hermetically packaged with a low surface energy self-assembled-monolayer (SAM) based anti-stiction coating, along with an encapsulated source of this anti-stiction coating that serves as a reservoir. Exposure of the micro-mirror array to the environmental conditions was made possible by drilling two 1 mm holes in the hermetic package. This enabled the retention of the encapsulated SAM source in the package which was vital to understanding the effects of SAM re-deposition on the surface in the operating environment. The fastest accrual of stiction was seen in the 90°C, 80% RH split with approximately 80% of the micro-mirrors failing within 4.4 × 109 cycles (10 hours) with 2.7×10-14 Joules of Stiction Equivalent Energy while the 60°C, 20% RH showed the least stiction accrual rate with less than 2% failure for 2.26×1012 cycles (1500 hours). The failure data obtained from the experiments were used to do a reliability analysis by utilizing the Weibull distribution.

Original languageEnglish
Title of host publicationReliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
DOIs
StatePublished - 2010
EventReliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX - San Francisco, CA, United States
Duration: Jan 25 2010Jan 26 2010

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume7592
ISSN (Print)0277-786X

Conference

ConferenceReliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
CountryUnited States
CitySan Francisco, CA
Period01/25/1001/26/10

Keywords

  • Humidity
  • Reliability
  • Self-assembled monolayer
  • Stiction
  • Weibull

Fingerprint Dive into the research topics of 'Reliability study of a MEMS array under varying temperature and humidity conditions'. Together they form a unique fingerprint.

  • Cite this

    Sivakumar, G., Ranganathan, R., Gale, R., & Dallas, T. (2010). Reliability study of a MEMS array under varying temperature and humidity conditions. In Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX [75920C] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 7592). https://doi.org/10.1117/12.842384