Relation between mobility and diffusion factors for thermoset cure

Yan Meng; Sindee L. Simon

Relation between mobility and diffusion factors for thermoset cure

Yan Meng, Sindee L. Simon

Chemical Engineering

Research output: Contribution to conference › Paper › peer-review

Abstract

The temperature-modulated differential scanning calorimetry (TMDSC) response during cure of thermosetting materials is modeled using chemical reaction kinetics with diffusion control. Physical aging effects are incorporated into the model using the Tool-Narayanaswamy-Moynihan equations. We investigate the assumption that the mobility factor, which is often obtained from experimental TMDSC reversing heat flow data, is related to the diffusion factor.

Original language	English
Pages	2212-2216
Number of pages	5
State	Published - 2004
Event	ANTEC 2004 - Annual Technical Conference Proceedings - Chicago, IL., United States Duration: May 16 2004 → May 20 2004

Conference

Conference	ANTEC 2004 - Annual Technical Conference Proceedings
Country/Territory	United States
City	Chicago, IL.
Period	05/16/04 → 05/20/04

Cite this

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title = "Relation between mobility and diffusion factors for thermoset cure",

abstract = "The temperature-modulated differential scanning calorimetry (TMDSC) response during cure of thermosetting materials is modeled using chemical reaction kinetics with diffusion control. Physical aging effects are incorporated into the model using the Tool-Narayanaswamy-Moynihan equations. We investigate the assumption that the mobility factor, which is often obtained from experimental TMDSC reversing heat flow data, is related to the diffusion factor.",

author = "Yan Meng and Simon, {Sindee L.}",

year = "2004",

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pages = "2212--2216",

note = "ANTEC 2004 - Annual Technical Conference Proceedings ; Conference date: 16-05-2004 Through 20-05-2004",

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TY - CONF

T1 - Relation between mobility and diffusion factors for thermoset cure

AU - Meng, Yan

AU - Simon, Sindee L.

PY - 2004

Y1 - 2004

N2 - The temperature-modulated differential scanning calorimetry (TMDSC) response during cure of thermosetting materials is modeled using chemical reaction kinetics with diffusion control. Physical aging effects are incorporated into the model using the Tool-Narayanaswamy-Moynihan equations. We investigate the assumption that the mobility factor, which is often obtained from experimental TMDSC reversing heat flow data, is related to the diffusion factor.

AB - The temperature-modulated differential scanning calorimetry (TMDSC) response during cure of thermosetting materials is modeled using chemical reaction kinetics with diffusion control. Physical aging effects are incorporated into the model using the Tool-Narayanaswamy-Moynihan equations. We investigate the assumption that the mobility factor, which is often obtained from experimental TMDSC reversing heat flow data, is related to the diffusion factor.

UR - http://www.scopus.com/inward/record.url?scp=2442601546&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:2442601546

SP - 2212

EP - 2216

T2 - ANTEC 2004 - Annual Technical Conference Proceedings

Y2 - 16 May 2004 through 20 May 2004

ER -

Relation between mobility and diffusion factors for thermoset cure

Abstract

Conference

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