Relation between mobility and diffusion factors for thermoset cure

Yan Meng, Sindee L. Simon

Research output: Contribution to conferencePaperpeer-review

Abstract

The temperature-modulated differential scanning calorimetry (TMDSC) response during cure of thermosetting materials is modeled using chemical reaction kinetics with diffusion control. Physical aging effects are incorporated into the model using the Tool-Narayanaswamy-Moynihan equations. We investigate the assumption that the mobility factor, which is often obtained from experimental TMDSC reversing heat flow data, is related to the diffusion factor.

Original languageEnglish
Pages2212-2216
Number of pages5
StatePublished - 2004
EventANTEC 2004 - Annual Technical Conference Proceedings - Chicago, IL., United States
Duration: May 16 2004May 20 2004

Conference

ConferenceANTEC 2004 - Annual Technical Conference Proceedings
CountryUnited States
CityChicago, IL.
Period05/16/0405/20/04

Fingerprint Dive into the research topics of 'Relation between mobility and diffusion factors for thermoset cure'. Together they form a unique fingerprint.

Cite this