TY - GEN
T1 - Radio frequency dielectric characterization and processing of polymers containing nanomaterial susceptors
AU - Saed, Mohammad A.
AU - Patil, Nutan
AU - Green, Micah J.
PY - 2019/9
Y1 - 2019/9
N2 - This paper presents radio frequency (RF) methods for processing preceramic polymers and their dielectric characterization throughout the curing process. Nanomaterial fillers are dispersed in the polymers to act as susceptors and make the material more responsive to RF energy. Conventional methods to produce ceramics such as silicon carbide (SiC) rely on sintering at very high temperatures using conventional heating. Potential benefits of volumetric heating using RF energy over slow conventional heating methods include rapid and more uniform curing. Polycarbosilanes are preceramic polymers that can be used to produce SiC, however, they have low conductivity making them challenging to heat with RF energy. Adding nanomaterial fillers such as multiwalled carbon nanotubes (MWCNTs) to the polymer changes its dielectric properties so that they can absorb RF energy efficiently and, as a result, heat rapidly [1]-[3].
AB - This paper presents radio frequency (RF) methods for processing preceramic polymers and their dielectric characterization throughout the curing process. Nanomaterial fillers are dispersed in the polymers to act as susceptors and make the material more responsive to RF energy. Conventional methods to produce ceramics such as silicon carbide (SiC) rely on sintering at very high temperatures using conventional heating. Potential benefits of volumetric heating using RF energy over slow conventional heating methods include rapid and more uniform curing. Polycarbosilanes are preceramic polymers that can be used to produce SiC, however, they have low conductivity making them challenging to heat with RF energy. Adding nanomaterial fillers such as multiwalled carbon nanotubes (MWCNTs) to the polymer changes its dielectric properties so that they can absorb RF energy efficiently and, as a result, heat rapidly [1]-[3].
UR - http://www.scopus.com/inward/record.url?scp=85074937882&partnerID=8YFLogxK
U2 - 10.1109/ICEAA.2019.8879341
DO - 10.1109/ICEAA.2019.8879341
M3 - Conference contribution
T3 - Proceedings of the 2019 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019
BT - Proceedings of the 2019 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019
Y2 - 9 September 2019 through 13 September 2019
ER -