| Original language | English |
|---|---|
| Pages (from-to) | 33-42 |
| Journal | IEEE Transaction on Components, Packaging, and Manufacturing Technology |
| State | Published - 2004 |
“Printed Circuit Boards Recycling: A State-of Art Survey”
Hong-Chao Zhang, James Li, Sam Gao, Puneet Shivastava
Research output: Contribution to journal › Article › peer-review