Printed circuit board recycling: A state-of-the-art survey

Jianzhi Li, Puneet Shrivastava, Zong Gao, Hong Chao Zhang

Research output: Contribution to journalArticlepeer-review

130 Scopus citations

Abstract

This survey is done with an intention of providing a clear and comprehensive review of current practices and recent developments in the area of printed circuit boards (PCB) recycling. The aim of this paper is to be a reference for research and implementation for PCB recycling process. Original information is collected from the companies engaged in PCB recycling industry and articles published after 1990. The paper gives an overview of PCB structure, material composition and different recycling processes.

Original languageEnglish
Pages (from-to)33-42
Number of pages10
JournalIEEE Transactions on Electronics Packaging Manufacturing
Volume27
Issue number1
DOIs
StatePublished - Jan 2004

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