TY - JOUR
T1 - Printed circuit board recycling
T2 - A state-of-the-art survey
AU - Li, Jianzhi
AU - Shrivastava, Puneet
AU - Gao, Zong
AU - Zhang, Hong Chao
N1 - Funding Information:
Manuscript received October 18, 2003; revised January 13, 2004. This work was supported by the Texas Higher Education Coordination Board’s Advanced Technology Program (ATP) Award by Grant 003644-0241-2003. The authors are with the Industrial Engineering Department, Texas Tech University, Lubbock, TX 79409 USA. Digital Object Identifier 10.1109/TEPM.2004.830501
PY - 2004/1
Y1 - 2004/1
N2 - This survey is done with an intention of providing a clear and comprehensive review of current practices and recent developments in the area of printed circuit boards (PCB) recycling. The aim of this paper is to be a reference for research and implementation for PCB recycling process. Original information is collected from the companies engaged in PCB recycling industry and articles published after 1990. The paper gives an overview of PCB structure, material composition and different recycling processes.
AB - This survey is done with an intention of providing a clear and comprehensive review of current practices and recent developments in the area of printed circuit boards (PCB) recycling. The aim of this paper is to be a reference for research and implementation for PCB recycling process. Original information is collected from the companies engaged in PCB recycling industry and articles published after 1990. The paper gives an overview of PCB structure, material composition and different recycling processes.
UR - http://www.scopus.com/inward/record.url?scp=4544301219&partnerID=8YFLogxK
U2 - 10.1109/TEPM.2004.830501
DO - 10.1109/TEPM.2004.830501
M3 - Article
AN - SCOPUS:4544301219
SN - 1521-334X
VL - 27
SP - 33
EP - 42
JO - IEEE Transactions on Electronics Packaging Manufacturing
JF - IEEE Transactions on Electronics Packaging Manufacturing
IS - 1
ER -