@inproceedings{cc3c99f88ae94121bccf78d3c9b4ad7d,
title = "PIMS: A lightweight processing-in-memory accelerator for stencil computations",
abstract = "Stencil computation is a classic computational kernel present in many high-performance scientific applications, like image processing and partial differential equation solvers (PDE). A stencil computation sweeps over a multi-dimensional grid and repeatedly updates values associated with points using the values from neighboring points. Stencil computations often employ large datasets that exceed cache capacity, leading to excessive accesses to the memory subsystem. As such, 3D stencil computations on large grid sizes are memory-bound. In this paper we present PIMS, an in-memory accelerator for stencil computations. PIMS, implemented in the logic layer of a 3D-stacked memory, exploits the high bandwidth provided by through-silicon vias to reduce redundant memory traffic. Our comprehensive evaluation using three different grid sizes with six categories of orders indicate that the proposed architecture reduces 48.25% of data movement on average and obtains up to 65.55% of bank conflict reduction.",
keywords = "High Performance Computing, Hybrid Memory Cube, Processing-in-memory, Stencil Computation",
author = "Jie Li and Xi Wang and Antonino Tumeo and Brody Williams and Leidel, {John D.} and Yong Chen",
note = "Funding Information: We are thankful to the anonymous reviewers for their valuable feedback. This research is supported in part by the National Science Foundation under grant CNS-1338078, CNS-1362134, CCF-1409946, CCF-1718336, OAC-1835892, and CNS-1817094. We would also like to show our gratitude to the Graduate School of Texas Tech University for providing the Summer Thesis/Dissertation Research Award Scholarship for this project. Publisher Copyright: {\textcopyright} 2019 Association for Computing Machinery.; null ; Conference date: 30-09-2019 Through 03-10-2019",
year = "2019",
month = sep,
day = "30",
doi = "10.1145/3357526.3357550",
language = "English",
series = "ACM International Conference Proceeding Series",
publisher = "Association for Computing Machinery",
pages = "41--52",
booktitle = "MEMSYS 2019 - Proceedings of the International Symposium on Memory Systems",
}