Physical aging behavior in amorphous PEN film as measured by creep

Maria L. Cerrada, Gregory B. McKenna, Jim M. O'Reilly, Jehuda Greener, Jim R. Gillmor

Research output: Contribution to conferencePaper

2 Scopus citations

Abstract

Characterization of the viscoelastic and aging responses of poly(ethylene naphthalate) (PEN) is of increasing interest as this material begins to see greater use in commercial applications. In typical aging experiments, one quenches the sample from above the glass transition to the final aging temperature and performs sequential experiments at increasing aging times to `probe' the changes in viscoelastic response due to the ongoing structural recovery. In the case of PEN, studies of the aging response are complicated by the presence of two viscoelastic mechanisms. Here we describe work in which creep measurements are used to probe the aging and temperature dependencies of the viscoelastic behavior of amorphous PEN. The results show that the large sub-glass β* transition has a large influence on the viscoelastic response and complicates the possibility of using classical time-temperature or time-aging time superposition for its description. At low temperatures and short aging times, one observes an almost power law behavior. However, as the aging times get longer, a second mechanism becomes evident and time-aging time superposition is not valid. In addition, as the temperature increases one also sees evidence for two mechanisms and lack of thermo-rheological simplicity.

Original languageEnglish
Pages2198-2203
Number of pages6
StatePublished - 1998
EventProceedings of the 1998 56th Annual Technical Conference, ANTEC. Part 1 (of 3) - Atlanta, GA, USA
Duration: Apr 26 1998Apr 30 1998

Conference

ConferenceProceedings of the 1998 56th Annual Technical Conference, ANTEC. Part 1 (of 3)
CityAtlanta, GA, USA
Period04/26/9804/30/98

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    Cerrada, M. L., McKenna, G. B., O'Reilly, J. M., Greener, J., & Gillmor, J. R. (1998). Physical aging behavior in amorphous PEN film as measured by creep. 2198-2203. Paper presented at Proceedings of the 1998 56th Annual Technical Conference, ANTEC. Part 1 (of 3), Atlanta, GA, USA, .