Numerical evaluation of hydrogen outgassing from copper electrodes with mitigation based on a tungsten capping layer

J. Acharjee, R. P. Joshi

Research output: Contribution to journalArticle

Abstract

Outgassing remains a pertinent issue for high power applications and is exacerbated by the high field driven, localized heating environments commonly encountered. Here, molecular dynamics simulations are performed for a simple model-based assessment of outgassing from electrodes. Our results of temperature dependent diffusion coefficients for hydrogen in copper agree well with experimental reports over a wide range spanning 300 K to 1330 K. Separate results are also obtained for transport of hydrogen to ascertain whether a grain-boundary would facilitate channeled transport or work to impede flow by clustering the gas atoms. Finally, the use of a tungsten overlayer on copper is evaluated as a material-based strategy for mitigating outgassing. It is demonstrated that a few monolayers of tungsten coating on the outer surface can be effective in significantly reducing outdiffusion at 700 K.

Original languageEnglish
Article number093504
JournalPhysics of Plasmas
Volume26
Issue number9
DOIs
StatePublished - Sep 1 2019

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