TY - GEN
T1 - Modified weibull failure theory for size effect prediction of brittle thin film
AU - Khandaker, M.
AU - Dhorje, M.
AU - Ekwaro-Osire, S.
PY - 2007
Y1 - 2007
N2 - A brittle thin film bonded to a substrate is common in MEMS components. At the edge of the interface, high stress gradients exist. It has been observed that mechanical strengthening of the thin film with decreasing film size occurs due to two constraints, namely, the microstructural constraint and the geometrical constraint. Consideration of both these constraints is required to properly predict the size effect impact on the strength of a brittle thin film. In this paper, a statistical approach is developed to predict the size effect of a brittle thin film on a substrate.
AB - A brittle thin film bonded to a substrate is common in MEMS components. At the edge of the interface, high stress gradients exist. It has been observed that mechanical strengthening of the thin film with decreasing film size occurs due to two constraints, namely, the microstructural constraint and the geometrical constraint. Consideration of both these constraints is required to properly predict the size effect impact on the strength of a brittle thin film. In this paper, a statistical approach is developed to predict the size effect of a brittle thin film on a substrate.
UR - http://www.scopus.com/inward/record.url?scp=37349120760&partnerID=8YFLogxK
U2 - 10.1115/IMECE2006-14926
DO - 10.1115/IMECE2006-14926
M3 - Conference contribution
AN - SCOPUS:37349120760
SN - 079184773X
SN - 9780791847732
T3 - Proceedings of the Materials Division, The ASME Non-Destructive Evaluation Division and The ASME Pressure Vessels and Piping Division, 2006
SP - 557
EP - 564
BT - Proceedings of the Materials Division, The ASME Non-Destructive Evaluation Division and The ASME Pressure Vessels and Piping Division, 2006
T2 - 2006 ASME International Mechanical Engineering Congress and Exposition
Y2 - 5 October 2007 through 10 October 2007
ER -