Modified weibull failure theory for size effect prediction of brittle thin film

M. Khandaker, M. Dhorje, S. Ekwaro-Osire

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

A brittle thin film bonded to a substrate is common in MEMS components. At the edge of the interface, high stress gradients exist. It has been observed that mechanical strengthening of the thin film with decreasing film size occurs due to two constraints, namely, the microstructural constraint and the geometrical constraint. Consideration of both these constraints is required to properly predict the size effect impact on the strength of a brittle thin film. In this paper, a statistical approach is developed to predict the size effect of a brittle thin film on a substrate.

Original languageEnglish
Title of host publicationProceedings of the Materials Division, The ASME Non-Destructive Evaluation Division and The ASME Pressure Vessels and Piping Division, 2006
Pages557-564
Number of pages8
DOIs
StatePublished - 2007
Event2006 ASME International Mechanical Engineering Congress and Exposition - Chicago, IL, United States
Duration: Oct 5 2007Oct 10 2007

Publication series

NameProceedings of the Materials Division, The ASME Non-Destructive Evaluation Division and The ASME Pressure Vessels and Piping Division, 2006

Conference

Conference2006 ASME International Mechanical Engineering Congress and Exposition
CountryUnited States
CityChicago, IL
Period10/5/0710/10/07

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    Khandaker, M., Dhorje, M., & Ekwaro-Osire, S. (2007). Modified weibull failure theory for size effect prediction of brittle thin film. In Proceedings of the Materials Division, The ASME Non-Destructive Evaluation Division and The ASME Pressure Vessels and Piping Division, 2006 (pp. 557-564). (Proceedings of the Materials Division, The ASME Non-Destructive Evaluation Division and The ASME Pressure Vessels and Piping Division, 2006). https://doi.org/10.1115/IMECE2006-14926