Modified weibull failure theory for size effect prediction of brittle thin film

M. Khandaker, M. Dhorje, S. Ekwaro-Osire

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A brittle thin film bonded to a substrate is common in MEMS components. At the edge of the interface, high stress gradients exist. It has been observed that mechanical strengthening of the thin film with decreasing film size occurs due to two constraints, namely, the microstructural constraint and the geometrical constraint. Consideration of both these constraints is required to properly predict the size effect impact on the strength of a brittle thin film. In this paper, a statistical approach is developed to predict the size effect of a brittle thin film on a substrate.

Original languageEnglish
Title of host publicationProceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Materials
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Print)0791837904, 9780791837900
StatePublished - 2006
Event2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Chicago, IL, United States
Duration: Nov 5 2006Nov 10 2006

Publication series

NameAmerican Society of Mechanical Engineers, Materials Division (Publication) MD
ISSN (Print)1071-6939

Conference

Conference2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006
CountryUnited States
CityChicago, IL
Period11/5/0611/10/06

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