TY - GEN
T1 - Modified weibull failure theory for size effect prediction of brittle thin film
AU - Khandaker, M.
AU - Dhorje, M.
AU - Ekwaro-Osire, S.
PY - 2006
Y1 - 2006
N2 - A brittle thin film bonded to a substrate is common in MEMS components. At the edge of the interface, high stress gradients exist. It has been observed that mechanical strengthening of the thin film with decreasing film size occurs due to two constraints, namely, the microstructural constraint and the geometrical constraint. Consideration of both these constraints is required to properly predict the size effect impact on the strength of a brittle thin film. In this paper, a statistical approach is developed to predict the size effect of a brittle thin film on a substrate.
AB - A brittle thin film bonded to a substrate is common in MEMS components. At the edge of the interface, high stress gradients exist. It has been observed that mechanical strengthening of the thin film with decreasing film size occurs due to two constraints, namely, the microstructural constraint and the geometrical constraint. Consideration of both these constraints is required to properly predict the size effect impact on the strength of a brittle thin film. In this paper, a statistical approach is developed to predict the size effect of a brittle thin film on a substrate.
UR - http://www.scopus.com/inward/record.url?scp=84920632073&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84920632073
SN - 0791837904
SN - 9780791837900
T3 - American Society of Mechanical Engineers, Materials Division (Publication) MD
BT - Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Materials
PB - American Society of Mechanical Engineers (ASME)
Y2 - 5 November 2006 through 10 November 2006
ER -