Lifetime estimation and reliability study of electrothermal MEMS actuators

Ganapathy Sivakumar, Stephen Johns, Jesus A. Nava, Tim Dallas

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

This work will present a detailed discussion on development of an automated test platform for reliability and lifetime expectancy studies of electrothermal micro-actuators. The actuators are designed using the top-most polysilicon layer of Sandia National Laboratories' SUMMiT V process. The image acquisition of the device is done using a Basler A 601f digital CCD c-mount camera, connected to a microscope with a 100 × magnification. To calculate the in-plane displacements of the device, a National Instruments' Vision image analysis software routine was utilized. An initial study is done to determine the actuator displacement characteristics with respect to the applied power. Based on the results from this study, the region of plastic deformation of the devices is determined. Arrhenius relationship theory is presented to model the plastic deformation based failure mechanism and allow the activation energy to be calculated.

Original languageEnglish
Title of host publicationReliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
DOIs
StatePublished - 2010
EventReliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX - San Francisco, CA, United States
Duration: Jan 25 2010Jan 26 2010

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume7592
ISSN (Print)0277-786X

Conference

ConferenceReliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
Country/TerritoryUnited States
CitySan Francisco, CA
Period01/25/1001/26/10

Keywords

  • Chevron actuator
  • Electrothermal actuator
  • Lifetime
  • Reliability

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