An active disassembly (AD) shape memory polymer nanocomposite (SMPN) fastener that is released by application of a thermal and magnetic field has been developed. Provided is key data on the behavior of the fastener at specific temperature ranges and magnetic field strengths for exhibiting proper levels for disassembly. Furthermore, a comparison of this fastener to a previous shape memory polymer (SMP) fastener shows differences in the thermal shape memory ability of the SMP fastener and the thermal-magnetic ability of the SMPN fastener. The SMPN fastener is an option for disassembly and exhibits added control parameters to single trigger AD fasteners.
- Life-cycle Assessment