TY - JOUR
T1 - HMC-SIM
T2 - A simulation framework for hybrid memory cube devices
AU - Leidel, John D.
AU - Chen, Yong
N1 - Publisher Copyright:
© 2014 World Scientific Publishing Company.
PY - 2014/12/22
Y1 - 2014/12/22
N2 - The recent advent of stacked die memory and logic technologies has lead to a resurgence in research associated with fundamental architectural techniques. Many architecture research projects begin with ample simulation of the target theoretical functions and approach. However, the logical and physical nature three-dimensional stacked devices, such as the Hybrid Memory Cube (HMC) specification, fundamentally do not align with traditional memory simulation techniques. As such, there currently exists a chasm in the capabilities of modern architectural simulation frameworks. This work introduces a new simulation framework developed specifically for the Hybrid Memory Cube specification. We present a set of novel techniques implemented on an associated development framework that provide an infrastructure to flexibly simulate one or more Hybrid Memory Cube stacked die memory devices attached to an arbitrary core processor. The goal of this development infrastructure is to provide architectural simulation frameworks the ability to begin migrating current banked DRAM memory models to stacked HMC-based designs without a reduction in simulation fidelity or functionality. In addition to the core architecture, this work also presents a series of memory workload test results that represent unit stride and random access memory patterns using the HMC-Sim infrastructure. These evaluations confirm that HMC-Sim can provide insightful guidance in designing and developing highly efficient systems, algorithms, and applications, considering the next-generation three-dimensional stacked memory devices.
AB - The recent advent of stacked die memory and logic technologies has lead to a resurgence in research associated with fundamental architectural techniques. Many architecture research projects begin with ample simulation of the target theoretical functions and approach. However, the logical and physical nature three-dimensional stacked devices, such as the Hybrid Memory Cube (HMC) specification, fundamentally do not align with traditional memory simulation techniques. As such, there currently exists a chasm in the capabilities of modern architectural simulation frameworks. This work introduces a new simulation framework developed specifically for the Hybrid Memory Cube specification. We present a set of novel techniques implemented on an associated development framework that provide an infrastructure to flexibly simulate one or more Hybrid Memory Cube stacked die memory devices attached to an arbitrary core processor. The goal of this development infrastructure is to provide architectural simulation frameworks the ability to begin migrating current banked DRAM memory models to stacked HMC-based designs without a reduction in simulation fidelity or functionality. In addition to the core architecture, this work also presents a series of memory workload test results that represent unit stride and random access memory patterns using the HMC-Sim infrastructure. These evaluations confirm that HMC-Sim can provide insightful guidance in designing and developing highly efficient systems, algorithms, and applications, considering the next-generation three-dimensional stacked memory devices.
KW - Computer simulation
KW - memory architecture
KW - memory management
UR - http://www.scopus.com/inward/record.url?scp=84929589639&partnerID=8YFLogxK
U2 - 10.1142/S012962641442002X
DO - 10.1142/S012962641442002X
M3 - Article
AN - SCOPUS:84929589639
SN - 0129-6264
VL - 24
JO - Parallel Processing Letters
JF - Parallel Processing Letters
IS - 4
M1 - 1442002
ER -