TY - JOUR
T1 - High temperature packaging and pulse testing of parallel sic thyristors
AU - Geil, Bruce R.
AU - Bayne, Stephen B.
AU - O'Brien, Heather
PY - 2006
Y1 - 2006
N2 - For fast rise time, high peak current pulse power applications, Silicon Carbide (SiC) is ideal due to its ability to tolerate high localized temperatures generated during switching. Several 4 mm × 4 mm SiC Gate Turn-Off thyristors (GTOs) manufactured by CREE were evaluated. Testing for individual and paired devices was performed under both single and repetitive pulsing using variable pulse duration, ring-down capacitor discharge circuit. At 150 °C, maximum single shot currents as high as 3.2 kA have been shown for single devices at a 50% pulse width of 2 μsec while parallel devices have shown a maximum of 4.4 kA at 150 °C.
AB - For fast rise time, high peak current pulse power applications, Silicon Carbide (SiC) is ideal due to its ability to tolerate high localized temperatures generated during switching. Several 4 mm × 4 mm SiC Gate Turn-Off thyristors (GTOs) manufactured by CREE were evaluated. Testing for individual and paired devices was performed under both single and repetitive pulsing using variable pulse duration, ring-down capacitor discharge circuit. At 150 °C, maximum single shot currents as high as 3.2 kA have been shown for single devices at a 50% pulse width of 2 μsec while parallel devices have shown a maximum of 4.4 kA at 150 °C.
UR - http://www.scopus.com/inward/record.url?scp=85072417689&partnerID=8YFLogxK
U2 - 10.4271/2006-01-3106
DO - 10.4271/2006-01-3106
M3 - Conference article
AN - SCOPUS:85072417689
SN - 0148-7191
JO - SAE Technical Papers
JF - SAE Technical Papers
Y2 - 7 November 2006 through 9 November 2006
ER -