High-Density Photonic Chip with All-Dielectric Metamaterials

Sangsik Kim; Saman Jahani; Jonathan Atkinson; Justin C. Wirth; Farid Kalhor; Abdullah Al Noman; Ward D. Newman; Prashant Shekhar; Kyunghun Han; Vien Van; Raymond G. DeCorby; Lukas Chrostowski; Minghao Qi; Zubin Jacob

High-Density Photonic Chip with All-Dielectric Metamaterials

Sangsik Kim, Saman Jahani, Jonathan Atkinson, Justin C. Wirth, Farid Kalhor, Abdullah Al Noman, Ward D. Newman, Prashant Shekhar, Kyunghun Han, Vien Van, Raymond G. DeCorby, Lukas Chrostowski, Minghao Qi, Zubin Jacob

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

We present an extreme skin-depth (e-skid) waveguide scheme, whose evanescent field is suppressed significantly. We demonstrate it on a monolithic silicon chip, reducing the waveguide crosstalk and bending loss for a high-density photonic chip integration.

Original language	English
Title of host publication	2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Print)	9781943580422
State	Published - Aug 6 2018
Event	2018 Conference on Lasers and Electro-Optics, CLEO 2018 - San Jose, United States Duration: May 13 2018 → May 18 2018

Publication series

Name	2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings

Conference

Conference	2018 Conference on Lasers and Electro-Optics, CLEO 2018
Country/Territory	United States
City	San Jose
Period	05/13/18 → 05/18/18

Cite this

Kim, S., Jahani, S., Atkinson, J., Wirth, J. C., Kalhor, F., Noman, A. A., Newman, W. D., Shekhar, P., Han, K., Van, V., DeCorby, R. G., Chrostowski, L., Qi, M., & Jacob, Z. (2018). High-Density Photonic Chip with All-Dielectric Metamaterials. In 2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings Article 8427869 (2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings). Institute of Electrical and Electronics Engineers Inc..

@inproceedings{ee15d8e257404b2589ecd0b5bad9adab,

title = "High-Density Photonic Chip with All-Dielectric Metamaterials",

abstract = "We present an extreme skin-depth (e-skid) waveguide scheme, whose evanescent field is suppressed significantly. We demonstrate it on a monolithic silicon chip, reducing the waveguide crosstalk and bending loss for a high-density photonic chip integration.",

author = "Sangsik Kim and Saman Jahani and Jonathan Atkinson and Wirth, {Justin C.} and Farid Kalhor and Noman, {Abdullah Al} and Newman, {Ward D.} and Prashant Shekhar and Kyunghun Han and Vien Van and DeCorby, {Raymond G.} and Lukas Chrostowski and Minghao Qi and Zubin Jacob",

note = "Publisher Copyright: {\textcopyright} 2018 OSA.; 2018 Conference on Lasers and Electro-Optics, CLEO 2018 ; Conference date: 13-05-2018 Through 18-05-2018",

year = "2018",

month = aug,

day = "6",

language = "English",

isbn = "9781943580422",

series = "2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings",

}

Kim, S, Jahani, S, Atkinson, J, Wirth, JC, Kalhor, F, Noman, AA, Newman, WD, Shekhar, P, Han, K, Van, V, DeCorby, RG, Chrostowski, L, Qi, M & Jacob, Z 2018, High-Density Photonic Chip with All-Dielectric Metamaterials. in 2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings., 8427869, 2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings, Institute of Electrical and Electronics Engineers Inc., 2018 Conference on Lasers and Electro-Optics, CLEO 2018, San Jose, United States, 05/13/18.

High-Density Photonic Chip with All-Dielectric Metamaterials. / Kim, Sangsik; Jahani, Saman; Atkinson, Jonathan et al.
2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. 8427869 (2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - High-Density Photonic Chip with All-Dielectric Metamaterials

AU - Kim, Sangsik

AU - Jahani, Saman

AU - Atkinson, Jonathan

AU - Wirth, Justin C.

AU - Kalhor, Farid

AU - Noman, Abdullah Al

AU - Newman, Ward D.

AU - Shekhar, Prashant

AU - Han, Kyunghun

AU - Van, Vien

AU - DeCorby, Raymond G.

AU - Chrostowski, Lukas

AU - Qi, Minghao

AU - Jacob, Zubin

PY - 2018/8/6

Y1 - 2018/8/6

N2 - We present an extreme skin-depth (e-skid) waveguide scheme, whose evanescent field is suppressed significantly. We demonstrate it on a monolithic silicon chip, reducing the waveguide crosstalk and bending loss for a high-density photonic chip integration.

AB - We present an extreme skin-depth (e-skid) waveguide scheme, whose evanescent field is suppressed significantly. We demonstrate it on a monolithic silicon chip, reducing the waveguide crosstalk and bending loss for a high-density photonic chip integration.

UR - http://www.scopus.com/inward/record.url?scp=85052578182&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:85052578182

SN - 9781943580422

T3 - 2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings

BT - 2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2018 Conference on Lasers and Electro-Optics, CLEO 2018

Y2 - 13 May 2018 through 18 May 2018

ER -

High-Density Photonic Chip with All-Dielectric Metamaterials

Abstract

Publication series

Conference

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