High-Density Photonic Chip with All-Dielectric Metamaterials

Sangsik Kim, Saman Jahani, Jonathan Atkinson, Justin C. Wirth, Farid Kalhor, Abdullah Al Noman, Ward D. Newman, Prashant Shekhar, Kyunghun Han, Vien Van, Raymond G. DeCorby, Lukas Chrostowski, Minghao Qi, Zubin Jacob

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present an extreme skin-depth (e-skid) waveguide scheme, whose evanescent field is suppressed significantly. We demonstrate it on a monolithic silicon chip, reducing the waveguide crosstalk and bending loss for a high-density photonic chip integration.

Original languageEnglish
Title of host publication2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781943580422
StatePublished - Aug 6 2018
Event2018 Conference on Lasers and Electro-Optics, CLEO 2018 - San Jose, United States
Duration: May 13 2018May 18 2018

Publication series

Name2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings

Conference

Conference2018 Conference on Lasers and Electro-Optics, CLEO 2018
CountryUnited States
CitySan Jose
Period05/13/1805/18/18

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  • Cite this

    Kim, S., Jahani, S., Atkinson, J., Wirth, J. C., Kalhor, F., Noman, A. A., Newman, W. D., Shekhar, P., Han, K., Van, V., DeCorby, R. G., Chrostowski, L., Qi, M., & Jacob, Z. (2018). High-Density Photonic Chip with All-Dielectric Metamaterials. In 2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings [8427869] (2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings). Institute of Electrical and Electronics Engineers Inc..