High-density photonic chip with all-dielectric metamaterials

Sangsik Kim, Saman Jahani, Jonathan Atkinson, Justin C. Wirth, Farid Kalhor, Abdullah Al Noman, Ward D. Newman, Prashant Shekhar, Kyunghun Han, Vien Van, Raymond G. DeCorby, Lukas Chrostowski, Minghao Qi, Zubin Jacob

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present an extreme skin-depth (e-skid) waveguide scheme, whose evanescent field is suppressed significantly. We demonstrate it on a monolithic silicon chip, reducing the waveguide crosstalk and bending loss for a high-density photonic chip integration.

Original languageEnglish
Title of host publicationCLEO
Subtitle of host publicationScience and Innovations, CLEO_SI 2018
PublisherOSA - The Optical Society
ISBN (Electronic)9781557528209
DOIs
StatePublished - 2018
EventCLEO: Science and Innovations, CLEO_SI 2018 - San Jose, United States
Duration: May 13 2018May 18 2018

Publication series

NameOptics InfoBase Conference Papers
VolumePart F94-CLEO_SI 2018

Conference

ConferenceCLEO: Science and Innovations, CLEO_SI 2018
CountryUnited States
CitySan Jose
Period05/13/1805/18/18

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  • Cite this

    Kim, S., Jahani, S., Atkinson, J., Wirth, J. C., Kalhor, F., Al Noman, A., Newman, W. D., Shekhar, P., Han, K., Van, V., DeCorby, R. G., Chrostowski, L., Qi, M., & Jacob, Z. (2018). High-density photonic chip with all-dielectric metamaterials. In CLEO: Science and Innovations, CLEO_SI 2018 (Optics InfoBase Conference Papers; Vol. Part F94-CLEO_SI 2018). OSA - The Optical Society. https://doi.org/10.1364/CLEO_SI.2018.STh4A.1