High-density photonic chip with all-dielectric metamaterials

Sangsik Kim; Saman Jahani; Jonathan Atkinson; Justin C. Wirth; Farid Kalhor; Abdullah Al Noman; Ward D. Newman; Prashant Shekhar; Kyunghun Han; Vien Van; Raymond G. DeCorby; Lukas Chrostowski; Minghao Qi; Zubin Jacob

doi:10.1364/CLEO_SI.2018.STh4A.1

High-density photonic chip with all-dielectric metamaterials

Sangsik Kim, Saman Jahani, Jonathan Atkinson, Justin C. Wirth, Farid Kalhor, Abdullah Al Noman, Ward D. Newman, Prashant Shekhar, Kyunghun Han, Vien Van, Raymond G. DeCorby, Lukas Chrostowski, Minghao Qi, Zubin Jacob

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

We present an extreme skin-depth (e-skid) waveguide scheme, whose evanescent field is suppressed significantly. We demonstrate it on a monolithic silicon chip, reducing the waveguide crosstalk and bending loss for a high-density photonic chip integration.

Original language	English
Title of host publication	CLEO
Subtitle of host publication	Science and Innovations, CLEO_SI 2018
Publisher	Optica Publishing Group (formerly OSA)
ISBN (Print)	9781943580422
DOIs	https://doi.org/10.1364/CLEO_SI.2018.STh4A.1
State	Published - 2018
Event	CLEO: Science and Innovations, CLEO_SI 2018 - San Jose, United States Duration: May 13 2018 → May 18 2018

Publication series

Name	Optics InfoBase Conference Papers
Volume	Part F94-CLEO_SI 2018
ISSN (Electronic)	2162-2701

Conference

Conference	CLEO: Science and Innovations, CLEO_SI 2018
Country/Territory	United States
City	San Jose
Period	05/13/18 → 05/18/18

Access to Document

10.1364/CLEO_SI.2018.STh4A.1

Cite this

Kim, S., Jahani, S., Atkinson, J., Wirth, J. C., Kalhor, F., Al Noman, A., Newman, W. D., Shekhar, P., Han, K., Van, V., DeCorby, R. G., Chrostowski, L., Qi, M., & Jacob, Z. (2018). High-density photonic chip with all-dielectric metamaterials. In CLEO: Science and Innovations, CLEO_SI 2018 (Optics InfoBase Conference Papers; Vol. Part F94-CLEO_SI 2018). Optica Publishing Group (formerly OSA). https://doi.org/10.1364/CLEO_SI.2018.STh4A.1

@inproceedings{2352f6888926456892b274f3d75d938e,

title = "High-density photonic chip with all-dielectric metamaterials",

abstract = "We present an extreme skin-depth (e-skid) waveguide scheme, whose evanescent field is suppressed significantly. We demonstrate it on a monolithic silicon chip, reducing the waveguide crosstalk and bending loss for a high-density photonic chip integration.",

author = "Sangsik Kim and Saman Jahani and Jonathan Atkinson and Wirth, {Justin C.} and Farid Kalhor and {Al Noman}, Abdullah and Newman, {Ward D.} and Prashant Shekhar and Kyunghun Han and Vien Van and DeCorby, {Raymond G.} and Lukas Chrostowski and Minghao Qi and Zubin Jacob",

note = "Publisher Copyright: {\textcopyright} OSA 2018.; CLEO: Science and Innovations, CLEO_SI 2018 ; Conference date: 13-05-2018 Through 18-05-2018",

year = "2018",

doi = "10.1364/CLEO_SI.2018.STh4A.1",

language = "English",

isbn = "9781943580422",

series = "Optics InfoBase Conference Papers",

publisher = "Optica Publishing Group (formerly OSA)",

booktitle = "CLEO",

}

Kim, S, Jahani, S, Atkinson, J, Wirth, JC, Kalhor, F, Al Noman, A, Newman, WD, Shekhar, P, Han, K, Van, V, DeCorby, RG, Chrostowski, L, Qi, M & Jacob, Z 2018, High-density photonic chip with all-dielectric metamaterials. in CLEO: Science and Innovations, CLEO_SI 2018. Optics InfoBase Conference Papers, vol. Part F94-CLEO_SI 2018, Optica Publishing Group (formerly OSA), CLEO: Science and Innovations, CLEO_SI 2018, San Jose, United States, 05/13/18. https://doi.org/10.1364/CLEO_SI.2018.STh4A.1

High-density photonic chip with all-dielectric metamaterials. / Kim, Sangsik; Jahani, Saman; Atkinson, Jonathan et al.
CLEO: Science and Innovations, CLEO_SI 2018. Optica Publishing Group (formerly OSA), 2018. (Optics InfoBase Conference Papers; Vol. Part F94-CLEO_SI 2018).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - High-density photonic chip with all-dielectric metamaterials

AU - Kim, Sangsik

AU - Jahani, Saman

AU - Atkinson, Jonathan

AU - Wirth, Justin C.

AU - Kalhor, Farid

AU - Al Noman, Abdullah

AU - Newman, Ward D.

AU - Shekhar, Prashant

AU - Han, Kyunghun

AU - Van, Vien

AU - DeCorby, Raymond G.

AU - Chrostowski, Lukas

AU - Qi, Minghao

AU - Jacob, Zubin

PY - 2018

Y1 - 2018

N2 - We present an extreme skin-depth (e-skid) waveguide scheme, whose evanescent field is suppressed significantly. We demonstrate it on a monolithic silicon chip, reducing the waveguide crosstalk and bending loss for a high-density photonic chip integration.

AB - We present an extreme skin-depth (e-skid) waveguide scheme, whose evanescent field is suppressed significantly. We demonstrate it on a monolithic silicon chip, reducing the waveguide crosstalk and bending loss for a high-density photonic chip integration.

UR - http://www.scopus.com/inward/record.url?scp=85048957853&partnerID=8YFLogxK

U2 - 10.1364/CLEO_SI.2018.STh4A.1

DO - 10.1364/CLEO_SI.2018.STh4A.1

M3 - Conference contribution

AN - SCOPUS:85048957853

SN - 9781943580422

T3 - Optics InfoBase Conference Papers

BT - CLEO

PB - Optica Publishing Group (formerly OSA)

T2 - CLEO: Science and Innovations, CLEO_SI 2018

Y2 - 13 May 2018 through 18 May 2018

ER -

High-density photonic chip with all-dielectric metamaterials

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