Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review

Weilong Cong, P.F. Zhang, Z.J. Pei

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)23–31
JournalKey Engineering Materials
StatePublished - Jan 2009

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