Experimental investigations on material removal rate and surface roughness in lapping of substrate wafers: A literature review

W. L. Cong, P. F. Zhang, Z. J. Pei

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Fingerprint

Dive into the research topics of 'Experimental investigations on material removal rate and surface roughness in lapping of substrate wafers: A literature review'. Together they form a unique fingerprint.

Chemistry

Engineering & Materials Science