@inproceedings{f20044c7755f40a8adc8d0891b4d07dd,
title = "Experimental investigations on flatness and subsurface damage in lapping of substrate wafers: A literature review",
abstract = "Lapping is an important material-removal process for manufacturing of substrate wafers. Objectives of lapping include removing subsurface damage in sliced wafers, thinning wafers to target thickness, and achieving desired flatness of wafer surfaces. A comprehensive literature review has been conducted on experimental investigations on lapping of substrate wafers. The review on material removal rate and surface roughness was published as a journal paper. As a follow-up, this paper reviews the literature on flatness and subsurface damage in lapping of substrate wafers. It presents reported experimental results on effects of process parameters on flatness and subsurface damage.",
keywords = "Flatness, Lapping, Machining, Semiconductor, Substrate wafer, Subsurface damage",
author = "Weilong Cong and Pie, {Z. J.} and Pengfei Zhang",
year = "2009",
doi = "10.1115/MSEC2009-84068",
language = "English",
isbn = "9780791843611",
series = "Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009",
pages = "683--689",
booktitle = "Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009",
note = "ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009 ; Conference date: 04-10-2009 Through 07-10-2009",
}