Experimental investigations on flatness and subsurface damage in lapping of substrate wafers: A literature review

Weilong Cong, Z. J. Pie, Pengfei Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Lapping is an important material-removal process for manufacturing of substrate wafers. Objectives of lapping include removing subsurface damage in sliced wafers, thinning wafers to target thickness, and achieving desired flatness of wafer surfaces. A comprehensive literature review has been conducted on experimental investigations on lapping of substrate wafers. The review on material removal rate and surface roughness was published as a journal paper. As a follow-up, this paper reviews the literature on flatness and subsurface damage in lapping of substrate wafers. It presents reported experimental results on effects of process parameters on flatness and subsurface damage.

Original languageEnglish
Title of host publicationProceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009
Pages683-689
Number of pages7
DOIs
StatePublished - 2009
EventASME International Manufacturing Science and Engineering Conference 2009, MSEC2009 - West Lafayette, IN, United States
Duration: Oct 4 2009Oct 7 2009

Publication series

NameProceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009
Volume1

Conference

ConferenceASME International Manufacturing Science and Engineering Conference 2009, MSEC2009
CountryUnited States
CityWest Lafayette, IN
Period10/4/0910/7/09

Keywords

  • Flatness
  • Lapping
  • Machining
  • Semiconductor
  • Substrate wafer
  • Subsurface damage

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  • Cite this

    Cong, W., Pie, Z. J., & Zhang, P. (2009). Experimental investigations on flatness and subsurface damage in lapping of substrate wafers: A literature review. In Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009 (pp. 683-689). (Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009; Vol. 1). https://doi.org/10.1115/MSEC2009-84068