TY - JOUR
T1 - Evaluation of long-term reliability and overcurrent capabilities of 15-kV SiC MOSFETs and 20-kV SiC IGBTs during narrow current pulsed conditions
AU - Kim, Matthew
AU - Forbes, J. J.
AU - Hirsch, Emily A.
AU - Schrock, James
AU - Lacouture, Shelby
AU - Bilbao, Argenis
AU - Bayne, Stephen B.
AU - O'Brien, Heather K.
AU - Ogunniyi, Aderinto A.
N1 - Funding Information:
Manuscript received June 22, 2020; revised September 2, 2020; accepted October 2, 2020. Date of publication October 23, 2020; date of current version November 10, 2020. This work was supported by the U.S. Army Research Laboratory (ARL). The review of this article was arranged by Senior Editor R. P. Joshi. (Corresponding author: Matthew Kim.) Matthew Kim, J. J. Forbes, Emily A. Hirsch, James Schrock, Shelby Lacouture, Argenis Bilbao, and Stephen B. Bayne are with the Center for Pulsed Power and Power Electronics, Texas Tech University, Lubbock, TX 79409 USA (e-mail: matthew.kim@ttu.edu).
Publisher Copyright:
© 1973-2012 IEEE.
PY - 2020/11
Y1 - 2020/11
N2 - Silicon carbide (SiC) is becoming a preferred technology of choice for power dense application compared with silicon (Si). A more comprehensive analysis of the long-term pulsed power reliability of SiC is necessary so that the technology can make the transition commercially. In this article, a testbed is utilized to evaluate research grade 15-kV SiC MOSFETs and 20-kV SiC IGBTs manufactured by Wolfspeed, a Cree Company. A testbed was developed here at Texas Tech University (TTU), Lubbock, TX, USA, to test these two devices. The narrow pulse testbed's capacitor bank can be charged up to 10 kV and output square waveform pulse up to 2.0 μ s. The waveform has a full-width at half-maximum pulse and is tested at a repetition pulse rate of three seconds. The electrical characteristics of the forward conduction and reverse breakdown of the device under test (DUT) are measured periodically during the experiment. The DUTs were pulsed at different current levels, up to 340 A (1.06 kA/cm2) for the IGBTs and 74 A (296 A/cm2) for MOSFETs, while the electrical device degradation was monitored. This work discusses the results of the long-term pulsed power reliability, failure modes, and their robustness in overcurrent operations of high-power SiC MOSFETs and IGBTs.
AB - Silicon carbide (SiC) is becoming a preferred technology of choice for power dense application compared with silicon (Si). A more comprehensive analysis of the long-term pulsed power reliability of SiC is necessary so that the technology can make the transition commercially. In this article, a testbed is utilized to evaluate research grade 15-kV SiC MOSFETs and 20-kV SiC IGBTs manufactured by Wolfspeed, a Cree Company. A testbed was developed here at Texas Tech University (TTU), Lubbock, TX, USA, to test these two devices. The narrow pulse testbed's capacitor bank can be charged up to 10 kV and output square waveform pulse up to 2.0 μ s. The waveform has a full-width at half-maximum pulse and is tested at a repetition pulse rate of three seconds. The electrical characteristics of the forward conduction and reverse breakdown of the device under test (DUT) are measured periodically during the experiment. The DUTs were pulsed at different current levels, up to 340 A (1.06 kA/cm2) for the IGBTs and 74 A (296 A/cm2) for MOSFETs, while the electrical device degradation was monitored. This work discusses the results of the long-term pulsed power reliability, failure modes, and their robustness in overcurrent operations of high-power SiC MOSFETs and IGBTs.
KW - Failure modes
KW - IGBTs
KW - MOSFETs
KW - gate oxide failure
KW - reliability
KW - safe operating area (SOA)
KW - silicon carbide (SiC)
UR - http://www.scopus.com/inward/record.url?scp=85096120859&partnerID=8YFLogxK
U2 - 10.1109/TPS.2020.3030295
DO - 10.1109/TPS.2020.3030295
M3 - Article
AN - SCOPUS:85096120859
SN - 0093-3813
VL - 48
SP - 3962
EP - 3967
JO - IEEE Transactions on Plasma Science
JF - IEEE Transactions on Plasma Science
IS - 11
M1 - 9238402
ER -