Effect of planarization on the contact behavior of patterned media

Emerson Escobar Nunez, Chang Dong Yeo, Raja R. Katta, Andreas A. Polycarpou

Research output: Contribution to journalArticle

6 Scopus citations

Abstract

The contact behavior of patterned media was examined using a 2-D plane strain finite-element model. The maximum stresses always occurred on the lower right corner of the pattern at the edge of the contact. The effects of planarization on the resulting contact stresses for different filling materials were compared. Using a filling material resulted in a decrease of the contact stresses in the patterns since it not only made the media more robust, but it also helped in relieving the contact load on the top of the patterns. In comparing harder and softer filling materials, it was found that harder materials offer a slight advantage in alleviating the stresses.

Original languageEnglish
Pages (from-to)3667-3670
Number of pages4
JournalIEEE Transactions on Magnetics
Volume44
Issue number11 PART 2
DOIs
StatePublished - Nov 2008

Keywords

  • Contacts
  • Finite-element analysis (FEA)
  • Magnetic recording
  • Patterned media
  • Planarization

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