Effect of cure cycle on residual stress development in thermosetting materials

Mikhail Merzlyakov, Gregory B. McKenna, Sindee L. Simon

Research output: Contribution to conferencePaper

Abstract

We have studied the effect of cure cycle on isotropic residual stress development stress development in thermosetting resins during cure and subsequent thermal cycling. We use a thick-walled tube to impose three-dimensional isotropic constraints on the resin. The strain at the outer surface of the load cell is monitored by strain gauges. Cure-induced stresses are much lower than expected from cure shrinkage due to the inability of the curing resin to sustain large tensile stresses in the rubbery state.

Original languageEnglish
Pages2227-2230
Number of pages4
StatePublished - 2004
EventANTEC 2004 - Annual Technical Conference Proceedings - Chicago, IL., United States
Duration: May 16 2004May 20 2004

Conference

ConferenceANTEC 2004 - Annual Technical Conference Proceedings
CountryUnited States
CityChicago, IL.
Period05/16/0405/20/04

Keywords

  • Cure stress
  • Isotropic stress
  • Thermal pressure coefficient
  • Thermosetting resins

Fingerprint Dive into the research topics of 'Effect of cure cycle on residual stress development in thermosetting materials'. Together they form a unique fingerprint.

  • Cite this

    Merzlyakov, M., McKenna, G. B., & Simon, S. L. (2004). Effect of cure cycle on residual stress development in thermosetting materials. 2227-2230. Paper presented at ANTEC 2004 - Annual Technical Conference Proceedings, Chicago, IL., United States.