Designing surface-Mounted components for high reliability

J. Rasty, W. Kolarik, B. Chen

Research output: Contribution to journalArticlepeer-review

Abstract

Recent emphasis of the Department of Defense (DOD) on the reliability and integrity of avionics has spurred a new wave of research on this subject. This paper presents the results of a parametric investigation conducted to study the effect of vibration direction, boundary conditions, stiffeners and/or point supports, lead type, lead height, and the layout of the components on the natural frequencies and stresses exerted on a typical printed circuit board (PCB) used in avionics. The “robust design” procedure was adopted using a series of computer-simulated experiments. A finite element software, EMRC-FEAP, was utilized to estimate the maximum von Mises stresses within the critical leads, while the statistical analysis system (SAS) software was employed to analyze the natural frequency responses of the system and the signal-to-noise ratio (SNR) of the stresses induced at critical leads.

Original languageEnglish
Pages (from-to)232-239
Number of pages8
JournalJournal of Energy Resources Technology, Transactions of the ASME
Volume116
Issue number3
DOIs
StatePublished - Sep 1994

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