TY - GEN
T1 - Design of highly-efficient monolithic silicon power amplifiers using envelope-tracking for broadband wireless applications
AU - Lie, Donald Y.C.
AU - Lopez, Jerry
AU - Li, Yan
AU - Tsay, Jerry
N1 - Publisher Copyright:
Copyright 2014 IEICE.
PY - 2014/3/25
Y1 - 2014/3/25
N2 - A couple of design examples on highly-efficient fully-monolithic silicon-based envelope-tracking power amplifiers (ET-PA) for broadband wireless applications will be presented. These RF PAs are designed in SiGe BiCMOS technologies in either common-emitter (CE) or cascode topologies, as SiGe can deliver higher POUT with better breakdown robustness than their CMOS counterparts. The envelope modulator (EM) ICs are designed in CMOS to mate with PAs to form high-efficient monolithic SiGe BiCMOS ET-PA systems. Using 5/10/20 MHz LTE 16-QAM modulated inputs, these ET-PA systems can achieve 24-28 dBm linear POUT, passing stringent LTE linearity specs with overall system power-added-efficiency (PAE) above 40% without predistortion.
AB - A couple of design examples on highly-efficient fully-monolithic silicon-based envelope-tracking power amplifiers (ET-PA) for broadband wireless applications will be presented. These RF PAs are designed in SiGe BiCMOS technologies in either common-emitter (CE) or cascode topologies, as SiGe can deliver higher POUT with better breakdown robustness than their CMOS counterparts. The envelope modulator (EM) ICs are designed in CMOS to mate with PAs to form high-efficient monolithic SiGe BiCMOS ET-PA systems. Using 5/10/20 MHz LTE 16-QAM modulated inputs, these ET-PA systems can achieve 24-28 dBm linear POUT, passing stringent LTE linearity specs with overall system power-added-efficiency (PAE) above 40% without predistortion.
KW - Envelope modulator (EM)
KW - Envelope shaping method
KW - Envelope-tracking (ET)
KW - Long-term evolution (LTE)
KW - Power amplifier (PA)
KW - SiGe
KW - Through-silicon-via (TSV)
UR - http://www.scopus.com/inward/record.url?scp=84988222521&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84988222521
T3 - 2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014
SP - 1085
EP - 1088
BT - 2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 Asia-Pacific Microwave Conference, APMC 2014
Y2 - 4 November 2014 through 7 November 2014
ER -