Copper interactions with H, O, and the self-interstitial in silicon

Engineering & Materials Science

• Binding energy 100%
• Copper 51%
• Silicon 49%
• Deep level transient spectroscopy 37%
• Oxygen vacancies 32%
• Molecular dynamics 23%
• Atoms 21%
• Molecules 20%
• Oxygen 16%
• Hydrogen 16%
• Computer simulation 11%
• Temperature 8%

Physics & Astronomy

• interstitials 54%
• copper 44%
• binding energy 40%
• silicon 33%
• interactions 24%
• pushing 19%
• oxygen 18%
• vibration mode 14%
• voids 13%
• dissociation 12%
• molecular dynamics 11%
• hydrogen 9%
• molecules 8%
• spectroscopy 8%
• atoms 7%
• simulation 6%
• temperature 4%

Chemistry

• Interstitial 66%
• Binding Energy 55%
• Deep Level Transient Spectroscopy 35%
• Molecular Dynamics 15%
• Dissociation 15%
• Simulation 13%
• Hydrogen 10%
• Dioxygen 10%
• Molecule 7%