| Original language | English |
|---|---|
| Pages (from-to) | 512-517 |
| Journal | Journal of Electronic Packaging |
| State | Published - Dec 2007 |
An Experimental Approach for Thermal Characterization of Water-Cooled Heat Sinks Using Fourier Analysis Techniques
T E Salem, Stephen Bayne, D Porschet
Research output: Contribution to journal › Article