An experimental approach for thermal characterization of water-cooled heat sinks using fourier analysis techniques

Thomas E. Salem, Stephen B. Bayne, Don Porschet

Research output: Contribution to journalArticle

Abstract

As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a metal-oxide-semiconductor field-effect transistor on a water-cooled pole-arrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique using Fourier analysis techniques for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.

Original languageEnglish
Pages (from-to)512-517
Number of pages6
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume129
Issue number4
DOIs
StatePublished - Dec 2007

Fingerprint Dive into the research topics of 'An experimental approach for thermal characterization of water-cooled heat sinks using fourier analysis techniques'. Together they form a unique fingerprint.

  • Cite this