TY - GEN
T1 - An environmentally benign process model development for printed circuit board recycling
AU - Zhang, Hong Chao
AU - Ouyang, Xi
AU - Abadi, Alex
PY - 2006
Y1 - 2006
N2 - Delaminating and separation of obsolete Printed Circuit Board (PCB) is essential for its recycling. This paper presents an alternative environmentally benign process method for PCB recycling. Applying the solvent system, e.g. carbon dioxide and water under certain pressure and temperature, the PCB scraps could be delaminated easily. The separation of PCB into copper foil, glass fiber and polymer will be beneficial for further PCB recycling. The fundamental experiment mechanism is based on the polymer physics and polymerization. When the process temperature is raised above the polymer glass transition temperature Tg, polymer would be decomposed, which caused the main bonding force among PCB layers greatly reduced. Base on this principle several different processing circumstances were explored, including supercritical carbon dioxide; binary solvent system of CO 2 and H 2O; trinary solvent system of CO 2, H 2O and CH 3CH 2OH. The experiment facilities were set up and the input & output parameters were defined to evaluate the PCB delaminating result. Utility functions were developed to optimize the process conditions. The recommendations for future study are illustrated at the end of this paper.
AB - Delaminating and separation of obsolete Printed Circuit Board (PCB) is essential for its recycling. This paper presents an alternative environmentally benign process method for PCB recycling. Applying the solvent system, e.g. carbon dioxide and water under certain pressure and temperature, the PCB scraps could be delaminated easily. The separation of PCB into copper foil, glass fiber and polymer will be beneficial for further PCB recycling. The fundamental experiment mechanism is based on the polymer physics and polymerization. When the process temperature is raised above the polymer glass transition temperature Tg, polymer would be decomposed, which caused the main bonding force among PCB layers greatly reduced. Base on this principle several different processing circumstances were explored, including supercritical carbon dioxide; binary solvent system of CO 2 and H 2O; trinary solvent system of CO 2, H 2O and CH 3CH 2OH. The experiment facilities were set up and the input & output parameters were defined to evaluate the PCB delaminating result. Utility functions were developed to optimize the process conditions. The recommendations for future study are illustrated at the end of this paper.
KW - Electronics
KW - End of life
KW - Printed circuit board
KW - Recycling
UR - http://www.scopus.com/inward/record.url?scp=33845575089&partnerID=8YFLogxK
U2 - 10.1109/ISEE.2006.1650063
DO - 10.1109/ISEE.2006.1650063
M3 - Conference contribution
AN - SCOPUS:33845575089
SN - 1424403510
SN - 9781424403516
T3 - IEEE International Symposium on Electronics and the Environment
SP - 212
EP - 217
BT - Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment - Conference Record
T2 - 2006 IEEE International Symposium on Electronics and the Environment
Y2 - 8 May 2006 through 11 May 2006
ER -