Al 2O 3 - Al 2O 3 and Al 2O 3 - Ti solder joints-influence of ceramic metallization and thermal pretreatment on joint properties

Christian Leinenbach, Nico Weyrich, Hans Rudolf Elsener, Gerardo Gamez

Research output: Contribution to journalArticlepeer-review

21 Scopus citations

Abstract

In this work, Al 2O 3-Al 2O 3 and Al 2O 3-Ti solder joints intended for space applications were realized by applying metallic multilayers both on Ti and on polycrystalline Al 2O 3 substrates to ensure wetting during the soldering process. The eutectic Au-12Ge (wt%) alloy with a melting point of 361°C was used as solder material and two different multilayer systems on the ceramic (Cr-Ni/Ti-W/Au, Ti/Pt/Au) were investigated. The influence of different thermal pretreatments of the Al 2O 3 plates on the multilayer properties, the interface reactions during soldering and the mechanical properties were studied using Glow-Discharge Optical Emission Spectroscopy (GDOES), X-ray Photoelectron Spectroscopy (XPS), Scanning Electron Microscopy (SEM) and a shear test device. It is shown that joints with a good quality can be produced at a soldering temperature of 400°C, whereas their properties and fracture behavior are strongly dependent on the metallization layer properties and the thermal pretreatments.

Original languageEnglish
Pages (from-to)751-763
Number of pages13
JournalInternational Journal of Applied Ceramic Technology
Volume9
Issue number4
DOIs
StatePublished - Jul 2012

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