In this work, Al 2O 3-Al 2O 3 and Al 2O 3-Ti solder joints intended for space applications were realized by applying metallic multilayers both on Ti and on polycrystalline Al 2O 3 substrates to ensure wetting during the soldering process. The eutectic Au-12Ge (wt%) alloy with a melting point of 361°C was used as solder material and two different multilayer systems on the ceramic (Cr-Ni/Ti-W/Au, Ti/Pt/Au) were investigated. The influence of different thermal pretreatments of the Al 2O 3 plates on the multilayer properties, the interface reactions during soldering and the mechanical properties were studied using Glow-Discharge Optical Emission Spectroscopy (GDOES), X-ray Photoelectron Spectroscopy (XPS), Scanning Electron Microscopy (SEM) and a shear test device. It is shown that joints with a good quality can be produced at a soldering temperature of 400°C, whereas their properties and fracture behavior are strongly dependent on the metallization layer properties and the thermal pretre
|Journal||International Journal of Applied Ceramic Technology|
|State||Published - 2012|
Leinenbach, C. A., Weyrich, N. A., Elsener, H-R. A., & Gamez Goytia, G. (2012). Al 2O 3 - Al 2O 3 and Al 2O 3 - Ti solder joints-influence of ceramic metallization and thermal pretreatment on joint properties. International Journal of Applied Ceramic Technology, 751-763.