@inproceedings{fcf5bb1e85b34062887bbc0ea9ef0cf0,
title = "A high efficiency SiGe BiCMOS envelope-tracking power amplifier for W-CDMA applications",
abstract = "This paper presents a highly efficient power amplifier (PA) using the envelope tracking (ET) technique for 3G W-CDMA applications. The PA is designed in the IBM 0.35-μm SiGe BiCMOS process with through-silicon-via (TSV). The CMOS envelope modulator IC is designed and fabricated in the TSMC 0.35-μm SiGe BiCMOS process. The ET-PA system achieves an overall composite power-added-efficiency (PAE) of 35.4% at POUT of 26.5 dBm at 900 MHz with the W-CDMA signal and improves the PAE by 5% compared to that of the fixed-supply standalone SiGe PA.",
keywords = "Envelope modulator (EM), W-CDMA, envelope tracking (ET), power amplifier (PA), through-silicon-via (TSV)",
author = "Liu, {Yen Ting} and Ruili Wu and Jerry Lopez and Yan Li and Jerry Tsay and Lie, {Donald Y.C.}",
year = "2013",
doi = "10.1109/WMCaS.2013.6563555",
language = "English",
isbn = "9781479904556",
series = "Proceedings of the 2013 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems, WMCS 2013",
booktitle = "Proceedings of the 2013 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems, WMCS 2013",
note = "2013 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems, WMCS 2013 ; Conference date: 04-04-2013 Through 05-04-2013",
}